Porous Copper Foamrudzi rutsva rwezvinhu zvine yakanakisa thermal conductivity uye kupisa kwekudziya zvivakwa, kunyanya yakakodzera kupisa kwekupisa zvikumbiro muzvikamu zvemagetsi. Yakagadzirwa nemhangura ine chipanje-senge porous dhizaini, iyo inopa iyo yakawanda yakasarudzika zvimiro:

1. High thermal conductivity:Mhangura pachayo yakanaka yekupisa conductive zvinhu, uye iyo porous chimiro chemhangura furo inowedzera nzvimbo yayo uye inovandudza kupisa kwekupisa. Izvi zvinobvumira kukurumidza kuendesa kupisa kubva kune zvigadzirwa zvemagetsi kune zvakakomberedza zvakatipoteredza, zvinobudirira kuderedza chikamu chekushisa nekuvandudza kushanda uye kuvimbika.
2. Huremu:Iyo porous chimiro cheporous mhangura foam inoita kuti ive yakareruka uye haiwedzere mutoro kana huremu kune zvikamu.
3. Nzvimbo Yakakura Yepamusoro:Iyo porous chimiro inopa porous mhangura furo nzvimbo yakakura yepamusoro yekutsinhanisa kupisa kuri nani nenzvimbo yakatenderedza, zvichikonzera kuvandudzwa.kupisa kupisa kushanda zvakanaka.
4. Malleability:Porous copper foam inogona kuumbwa kuita maumbirwo akasiyana uye saizi kuti isangane nezvinodiwa zvekupisa kupisa.zvakasiyana-siyana zvemagetsi zvikamu.
5. Shock Resistance:Iyo porous chimiro cheporous mhangura foam inobatsira kunyudza uye kudzikisira kuvhunduka kwekunze uye kudengenyeka, kuchengetedza kugadzikana kwezvinhu zvemagetsi.

Porous mhangura furoinoshandiswa mumhando dzakasiyana-siyana dzezvishandiso zvemagetsi, kusanganisira asi kwete kugumira kune:
1. CPU uye GPU Heat Sink:Inoshandiswa pakupisa kunyura kwepakati pekugadzirisa zvikamu (CPU) uye graphics processing units (GPU) mumakomputa kuti inyatso kuendesa kupisa kure ne processor uye kuchengetedza zvikamu zvichishanda zvakatsiga.
2. LED kutonhora:inoshandiswa mumidziyo yemwenje ye LED, kuburikidza nekupisa kwekupisa kweiyo LED chip kuburitsa zvinobudirira kupisa kunoitwa ne LED kuwedzera hupenyu hwe LED.
3. Magetsi module:midziyo yemagetsi mune yemagetsi module inodawo kupisa kupisa, porous copper foam inogona kubatsira kudzikamisa tembiricha yekushanda yemagetsi emagetsi module.
4. Electronic Packaging:Mune mamwe epamusoro-anoshanda emagetsi mapakeji, mhangura porous foam inogona zvakare kushandiswa seyekupisa conduction nzira yekuona kuti kupisa kunogona kukurumidza kutamiswa uye kuburitswa.

Muchidimbu, sechinhu chinoshanda chinopisa chinopisa, foam yemhangura inoita basa rinokosha mumunda wezvikamu zvemagetsi, zvichibatsira kuchengetedza kugadzikana uye kushanda kwezvikamu.